Electronic-component mounting apparatus with monitoring device

Details Electronic-component mounting apparatus with monitoring device Electronic-component mounting apparatus with monitoring device

1992-03-02

1993-08-10

Hall, Carl E.

Metal working

Means to assemble or disassemble

With means to test work or product

29740, 29743, 29833, H05K 330

Patent

active

052337456

ABSTRACT:
An apparatus for mounting electronic components on a circuit board, the apparatus being equipped with an X-Y table assembly moveable in a horizontal plane and monitoring device attached to the X-Y table assembly. An electronic component picking and mounting head is attached to the X-Y table assembly so as to be movable in accordance with the movement thereof and also arranged to be moveable vertically with respect to a lower surface of the X-Y table assembly. The head includes a rotating shaft disposed to be substantially parallel to the X-Y table assembly rotatable about its own axis and at least two nozzles attached to the rotating shaft so as to be rotatable in accordance with the rotation thereof. The nozzles are coupled to an external vacuum device so as to allow a suction of the electronic component and allow it to be carried toward the circuit board, and positioned so that one of the nozzles can face the monitoring device by rotation of the rotating shaft so as to allow the monitoring device to monitor the electronic component picked up by the nozzle. This arrangement permits the electronic component to be effectively mounted on the circuit board in a relative short time.

REFERENCES:
patent: 5115559 (1992-05-01), Oyama

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