Electronic component mounting apparatus and method of...

Details Electronic component mounting apparatus and method of... Electronic component mounting apparatus and method of...

2005-04-08

2008-08-12

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S739000, C029S740000, C029S833000, C029S840000

Reexamination Certificate

active

07409761

ABSTRACT:
In an electronic component mounting process for mounting electronic components (6) to a substrate, each of the electronic components having an adhesive layer on a surface to be bonded to the substrate is picked up with suction nozzle provided with individual heater, and a time taken for the mounting operation is so allotted that a first heating time of a duration from a moment when the suction nozzle comes into contact with the electronic component for picking it up till another moment immediately before it begins a mounting motion to the substrate is longer than a second heating time of a duration from the moment when the suction nozzle begins the mounting motion till another moment when it leaves the electronic component mounted to the substrate.

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