Electronic component mounting apparatus and electronic...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S740000, C029S833000, C029S834000, C029S720000

Reexamination Certificate

active

11088112

ABSTRACT:
In an electronic component mounting apparatus for taking out a chip6from a component supply portion4to mount to a board16held by a board holding portion10, an image of a supply portion reference mark provided at a mark post18of the component supply portion2is taken by a second camera35moved by a camera moving mechanism, a camera coordinates system is calibrated based on a result of taking the image, thereafter, a position of the chip6is recognized by the second camera35and the chip6is picked up by a mounting head based on a result of the recognition. Thereby, stable pick up accuracy can be ensured by calibrating an aging variation of the coordinates system owing to thermal elongation or contraction of the camera moving mechanism.

REFERENCES:
patent: 6792676 (2004-09-01), Haji et al.
patent: 7102148 (2006-09-01), Kodama et al.
patent: 2725702 (1997-12-01), None
patent: 2003-188194 (2003-07-01), None
patent: 3511841 (2004-01-01), None

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