Semiconductor device manufacturing: process – Including control responsive to sensed condition – Interconnecting plural devices on semiconductor substrate
Reexamination Certificate
2006-04-25
2006-04-25
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Interconnecting plural devices on semiconductor substrate
C228S019000
Reexamination Certificate
active
07033842
ABSTRACT:
The present invention provides an electronic component mounting apparatus, wherein a high speed operation can be provided by simplifying the structure of a mounting head and wherein the working efficiency can be improved by eliminating the use of the mounting head for a coating process. In the electronic component mounting apparatus, a flux is coated on chips supplied to an electronic component feeding unit while bump formation faces are directed upward. The chips are mounted on a substrate. A holding head receives the chips extracted from an adhesive sheet by a mounting head and is inverted relative to a stage on which a flux is spread. As a result, the bumps of the chips are covered with the flux and are flattened, and after the holding head is returned to the original stage, the chips on the stage are extracted and mounted on the substrate by the mounting head.
REFERENCES:
patent: 5695667 (1997-12-01), Eguchi et al.
patent: 5839187 (1998-11-01), Sato et al.
patent: 5840594 (1998-11-01), Tsubouchi et al.
patent: 5872051 (1999-02-01), Fallon et al.
patent: 6759738 (2004-07-01), Fallon et al.
patent: 6789720 (2004-09-01), Uchida et al.
patent: 2003/0110610 (2003-06-01), Duquette et al.
patent: 02-31431 (1990-02-01), None
patent: 08-037209 (1996-02-01), None
patent: 09-008172 (1997-01-01), None
patent: 09-129658 (1997-05-01), None
patent: 10-022347 (1998-01-01), None
patent: 11-233713 (1999-08-01), None
patent: 2000-124264 (2000-04-01), None
patent: 2000100874 (2000-04-01), None
Haji Hiroshi
Hirakawa Toshiro
Coleman W. David
Matsushita Electric - Industrial Co., Ltd.
Pearne & Gordon LLP
LandOfFree
Electronic component mounting apparatus and electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic component mounting apparatus and electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component mounting apparatus and electronic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3590213