Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Reexamination Certificate
2006-04-11
2006-04-11
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
With control means responsive to sensed condition
Work-responsive
C228S049500, C228S102000, C029S833000
Reexamination Certificate
active
07025244
ABSTRACT:
In an electronic component mounting method in which electronic components are sucked/held by plural respective nozzles provided on a mounting head so as to be mounted on electronic component mounting portions of a board, such a mounting operation is sequentially carried out as to all of the electronic components, in which the electronic components are sucked/held by the plural nozzles; an electronic component sucked/held by one of the plural nozzles is provisionally positioned above one electronic component mounting portion; both this electronic component and the electronic component mounting portion are observed by an observation head which is located between the board and the mounting head; a relative position detecting operation for detecting a relative positional relationship between this electronic component and the electronic component mounting portion is carried out as to all of the electronic components held by the mounting head; and the electronic component is positioned with respect to the electronic component mounting portion so as to be mounted thereon while the detected relative positional relationship is reflected.
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patent: 2001-77592 (2001-03-01), None
Johnson Jonathan
Matsushita Electric - Industrial Co., Ltd.
Pearne & Gordon LLP
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