Electronic component mounting apparatus

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Patent

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Details

29836, B23P 1900

Patent

active

050350471

ABSTRACT:
An electronic component or chip mounting apparatus capable of carrying out a chip mounting operation at a high speed and with high accuracy. The apparatus includes two transition stations, a chip extracting head reciprocating between a chip feed section and the transition stations and two chip depositing heads arranged for reciprocating between the transition stations and a substrate on which a chip is to be mounted, so that a chip mounting operation may be carried out according to a reciprocating relay system and an operation of depositing the chip on the substrate may take place with high efficiency.

REFERENCES:
patent: 4644642 (1987-02-01), Wardenaar et al.
patent: 4675993 (1987-06-01), Harada

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