Electronic component mounting apparatus

Details Electronic component mounting apparatus Electronic component mounting apparatus

2007-11-20

2007-11-20

Chang, Rick K (Department: 3726)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S721000, C029S739000, C029S833000, C029S834000

Reexamination Certificate

active

10259783

ABSTRACT:
An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When the difference between the thickness of the electronic component detected by a sensor and the data on the thickness stored in the RAM is within the tolerance, a CPU judges that the component is held by a suction nozzle in a normal posture and executes a normal processing control. Then an image of the electronic component is captured by a recognition camera, and a recognition processing is made by an image processing unit to measure the geometry of the component. The CPU, then, judges whether the size of the component is within tolerance or not. When both X-dimension and Y-dimension of the component measured by the image processing unit are within the tolerance, the Y-dimension measured by the image processing unit and the thickness detected by the sensor are compared and the component is judged normal when the Y-dimension is larger.

REFERENCES:
patent: 5787577 (1998-08-01), Kent
patent: 6128074 (2000-10-01), Hong et al.
patent: 6178626 (2001-01-01), Hada et al.
patent: 0652699 (1995-05-01), None
patent: 63-249018 (1988-10-01), None
patent: 9-307292 (1997-11-01), None

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