Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate
1998-04-23
2001-01-30
Arbes, Carl J. (Department: 3729)
Metal working
Means to assemble or disassemble
Means to assemble electrical device
C029S743000, C029S759000, C029S721000, C901S040000
Reexamination Certificate
active
06178621
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for packaging an electronic component onto an electronic circuit board.
BACKGROUND OF THE INVENTION
In recent years, desired functions for an apparatus for mounting an electronic component onto an electronic circuit board have been the speed-up, an improvement in the mounting accuracy of an electronic component, the adaptability to the mounting of multifarious electronic components and an improvement in the quality of an electronic component.
FIG. 10
is a perspective view showing the whole outline configuration of a conventional electronic component mounting apparatus. In
FIG. 10
, Numerals
101
and
103
denote carrying means for carrying in/out an electronic circuit board
102
and drive means (XY robot) for positioning a head part
105
, incorporating a nozzle unit
104
for vacuum-clamping/mounting the electronic component, at any position. Numerals
106
,
107
and
108
denote electronic component supply means for supplying the electronic component, nozzle change part for exchanging a nozzle clamped by the nozzle unit
104
depending on packaged component and recognition section for recognizing the clamping posture of electronic component vacuum-clamped by the nozzle.
FIG. 11
is a principally sectional view showing the configuration of a nozzle unit in a conventional electronic component mounting apparatus. In
FIG. 11
, Numerals
111
,
112
,
113
,
114
and
115
denote a motor for positioning a rotational position, a speed reducer section for improving the rotational precision, a vacuum-clamping nozzle for vacuum-clamping an electronic component, a spring for urging the vacuum-clamping nozzle
113
and a pushing section for transmitting a spring force.
Next, the operation of an electronic component mounting apparatus (
FIG. 10
) composed of the above members and of a nozzle unit (
FIG. 11
) will be described.
The electronic circuit board
102
shown in
FIG. 10
is carried in the mounting position by means of the carrying means
101
. The drive means
103
positions the head section
105
onto the electronic component supply means
106
and after the positioning, the nozzle unit
104
in the head part
105
lowers to vacuum-clamp the electronic component.
Next, after vacuum-clamping the electronic component, the nozzle unit
104
rises and the head part
105
is positioned to the mounting position by the drive means
103
. In this move, the vacuum-clamped posture of the electronic component vacuum-clamped by the nozzle unit
104
is recognized in the recognition section
108
and the control section (not shown) performs a correcting computation to correct the position. After the positional correction, the nozzle unit
104
lowers and mounts the electronic component onto the electronic circuits board
102
.
In this electronic component mounting apparatus, the speed at which the nozzle unit
104
lowers is constant and cannot be made variable owing to the mechanism. Besides, the urging force at the time of mounting an electronic component is also defined by the spring
114
.
As mentioned above, simply under a definite urging force and only at a definite speed at the lowering time of a nozzle, a conventional electronic component mounting apparatus can mount an electronic component. Thus, an improvement in quality such as reduction of damages to an electronic component is required and furthermore, multiple sorts of electronic components at present leads to a demand for inserting a large-sized connector into an electronic circuit board, so that the need for a function able to exert a heavy load has taken place to implement this.
DISCLOSURE OF THE INVENTION
The present invention is made to solve this problem and its purpose is to deepen the adaptability of multifarious electronic components by reducing an impact load to electronic component and further by greatly extending the range of load.
In order to solve the above problem and to attain the purpose, the present invention has enabled any urging force exerted on the vacuum-clamping nozzle to be set by making the fluid pressure variable, further an urging force to be corrected for each vacuum-clamping nozzle, and the mounting speed of electronic component to be made variable, upon mounting multiple sorts of electronic component onto electronic circuit board.
According to the present invention, various electronic components including those requiring a heavy load and semiconductor elements subject to damages caused by inserted components can be coped with.
The present invention provides an electronic component mounting apparatus comprising component supply means for supplying an electronic component to a predetermined position and a vacuum-clamping nozzle unit for mounting the electronic component onto an electronic circuit board carried by carrying means and positioned at an predetermined position, wherein the above vacuum-clamping nozzle unit comprises an automatically detachable vacuum-clamping nozzle for vacuum-clamping the electronic component, a positioning section for positioning the vacuum-clamping nozzle in a rotating direction and a vertical direction, a pushing section for urging the vacuum-clamping nozzle downward by using fluid, a fluid pressure switching section for switching the urging force, a timing switching section for switching the timing of the urging force of the vacuum-clamping nozzle, and a pressure control section for controlling the load to a desired load.
With the present invention, switching the timing of the urging force can be made before or at the time of mounting the electronic component on an electronic circuit board. When the nozzle is exchanged corresponding to an electronic component requiring a heavy load or an electronic component such as a semiconductor element subject to a damage caused by inserted components, damages to the electronic component can be reduced by correcting the nozzle weight or the like and the component adaptability can be largely extended even to such semiconductor elements that are subject to damages.
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Fujiwara Muneyoshi
Hirai Wataru
Honkawa Hirokazu
Ohta Hiroshi
Shida Satoshi
Arbes Carl J.
Matsushita Electric - Industrial Co., Ltd.
Parkhurst & Wendel L.L.P.
Trinh Minh
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