Electronic component-mounted structure, method for mounting...

Details Electronic component-mounted structure, method for mounting... Electronic component-mounted structure, method for mounting...

2007-01-09

2007-01-09

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S782000, C257S783000

Reexamination Certificate

active

11216807

ABSTRACT:
An electronic component-mounted structure includes an electronic component having a bump electrode, the bump electrode including a projection made of a first resin and a conductive film covering at least a top of the projection; a substrate having a connecting terminal; and a second resin filling the space between the electronic component and the substrate, wherein the bump electrode abuts against the connecting terminal, and wherein the relationship T0<Tgr<Tgb is satisfied, where T0is an operating temperature of the electronic component mounted on the substrate, Tgb is a glass transition temperature of the first resin, and Tgr is a glass transition temperature of the second resin.

REFERENCES:
patent: 6388321 (2002-05-01), Hirai et al.
patent: 6590287 (2003-07-01), Ohuchi
patent: 2004/0182817 (2004-09-01), Murai et al.
patent: 05-182516 (1993-07-01), None
patent: 2000-101221 (2000-04-01), None
patent: 2001-160568 (2001-06-01), None

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