Electronic component module having electronic component with...

Details Electronic component module having electronic component with... Electronic component module having electronic component with...

2005-10-28

2008-11-18

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S782000, C174S254000

Reexamination Certificate

active

07453703

ABSTRACT:
The present invention is to provide a small-sized electronic component module in which RF units of a mobile phone for multi-band and multi-system are integrated at low cost. In the RF module, an RF transceiver LSI, a SAW chip, and chip components are mounted on a module board. The SAW chip is mounted on the module board so that a cavity is formed between itself and the module board, and the SAW chip and other components such as the RF transceiver LSI and the chip components are adhered to the module board at their peripheral portions by a sheet-like sealing material, and they are directly covered with the sheet-like sealing material from outside thereof.

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Technical Specification Group GSM/EDGE Radio Access Networks; Radio Transmission and Reception (Release 1999), 3GPP TS 05.05 V8.15.0 (Apr. 2003) of 3GPP (URL:L www.3gpp.org).
Technical Specification Group Radio Access Networks; UE Radio Transmission and Reception (FDD) (Release 6), 3GPP TS 25.101 V6.5.0 (Sep. 2004) of 3Gpp (URL: www.3gpp.org).

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