Electronic component module and method for manufacturing the...

Details Electronic component module and method for manufacturing the... Electronic component module and method for manufacturing the...

2007-09-10

2010-10-05

Lee, Jinhee J (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000

Reexamination Certificate

active

07808796

ABSTRACT:
An electronic component module comprises a circuit board having a cavity in one principal surface thereof. The electronic component module also comprises a first semiconductor device accommodated within the cavity and a second semiconductor device disposed on the one principal surface of the circuit board so as to cover the first semiconductor device in plan view. The electronic component module further comprises a resin material disposed to cover at least a side surface of the second semiconductor device.

REFERENCES:
patent: 5455383 (1995-10-01), Tanaka
patent: 5625536 (1997-04-01), Soyano et al.
patent: 6356453 (2002-03-01), Juskey et al.
patent: 6445591 (2002-09-01), Kwong
patent: 6890798 (2005-05-01), McMahon
patent: 6974724 (2005-12-01), Hyvonen et al.
patent: 7102220 (2006-09-01), Stevens et al.
patent: 7359213 (2008-04-01), Vasudivan et al.
patent: 2002/0140085 (2002-10-01), Lee et al.
patent: 06-291246 (1994-10-01), None
patent: 07-042165 (1995-07-01), None
patent: 10-326846 (1998-12-01), None
patent: 2001-068799 (2001-03-01), None
patent: 2003-204013 (2003-07-01), None

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