Electronic component module and manufacturing method thereof

Details Electronic component module and manufacturing method thereof Electronic component module and manufacturing method thereof

2007-06-26

2007-06-26

Pascal, Robert (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Strip type

C333S02400C, C333S02400C, C343S7000MS

Reexamination Certificate

active

10928244

ABSTRACT:
An electronic component module has a device-side module A and an antenna-side module B. The device-side module A is equipped with a first dielectric substrate11that is formed with a first transmission line11aand a high-frequency device13that is mounted on the first dielectric substrate11and is connected to the first transmission line11a.The antenna-side module B is equipped with a second dielectric substrate12that is laid on the first dielectric substrate11in such a manner that they are arranged in a lamination direction and that is formed with a second transmission line12athat is electrically connected to the first transmission line11,and an antenna element14that is provided on the second dielectric substrate12and electrically connected to the high-frequency device13via the second transmission line12aand the first transmission line11a.

REFERENCES:
patent: 5323128 (1994-06-01), Ishizaki et al.
patent: 5768109 (1998-06-01), Gulick et al.
patent: 6104264 (2000-08-01), Ishikawa et al.
patent: 6188297 (2001-02-01), Akiba
patent: 6455453 (2002-09-01), Chikagawa
patent: 6456172 (2002-09-01), Ishizaki et al.
patent: 6476463 (2002-11-01), Kaneko et al.
patent: 6515562 (2003-02-01), Takenoshita et al.
patent: 6570469 (2003-05-01), Yamada et al.
patent: 6784759 (2004-08-01), Maekawa et al.
patent: 6784765 (2004-08-01), Yamada et al.
patent: 6794961 (2004-09-01), Nagaishi et al.
patent: 6914787 (2005-07-01), Ajioka et al.
patent: 6917526 (2005-07-01), Ajioka et al.
patent: 7064630 (2006-06-01), Hirabayashi et al.
patent: 7102896 (2006-09-01), Ajioka et al.
patent: 0 198 698 (1986-10-01), None
patent: 0 963 001 (1999-12-01), None
patent: 1 307 078 (2003-05-01), None
patent: 2 710 195 (1995-03-01), None
patent: 63-316905 (1988-12-01), None
patent: 7-170115 (1995-07-01), None
patent: 9-64636 (1997-03-01), None
patent: 9-237867 (1997-09-01), None
patent: 10-303640 (1998-11-01), None
patent: 2000-216630 (2000-08-01), None
patent: 2001-28413 (2001-01-01), None
patent: 2002-164733 (2002-06-01), None
patent: 2003-204211 (2003-07-01), None
patent: WO 99/62135 (1999-12-01), None

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