Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-09-05
2006-09-05
Bui, Hung S. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S818000
Reexamination Certificate
active
07102896
ABSTRACT:
An electronic component module according to the invention includes: a mounting substrate11including a shield layer13and on which a first cavity14aand a second cavity14bare formed; a first electronic component16apositioned in the first cavity14aand used in a first frequency band; a second electronic component16bpositioned in the second cavity14band used in a second frequency band; lid members15which seal the first cavity14aand the second cavity14b; and patch antennas17which transmit/receive radio waves in the frequency bands, the antennas connected to the electronic components16; wherein the electronic components16are mounted on the mounting substrate11via a substrate component19having a higher heat resistance than the mounting substrate11and that the mounting substrate11is composed of a member having a lower dielectric constant that the substrate component19.
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Ajioka Eriko
Asami Shigeru
Ikeda Hiroshi
Kurata Hitoyoshi
Shimoda Hideaki
Bui Hung S.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
TDK Corporation
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