Electronic component module

Details Electronic component module Electronic component module

2005-07-05

2005-07-05

Vu, Phuong T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S818000

Reexamination Certificate

active

06914787

ABSTRACT:
An electronic component module includes a mounting substrate including a shield layer and on which a first cavity and a second cavity are formed. A first electronic component positioned in the first cavity is used in a first frequency band. A second electronic component positioned in the second cavity is used in a second frequency band. Lid members seal the first cavity and the second cavity. Patch antennas transmit/receive radio waves in the first and second frequency bands, the antennas being formed on a surface opposite to the electronic components mounting surface. And, connection terminals formed on the mounting substrate are electrically connected to the electronic components through transmission lines.

REFERENCES:
patent: 5633786 (1997-05-01), Matuszewski et al.
patent: 5828339 (1998-10-01), Patel
patent: 6320543 (2001-11-01), Ohata et al.
patent: 6-326488 (1994-11-01), None
patent: 9-237867 (1997-09-01), None
patent: 11-340371 (1999-12-01), None
U.S. Appl. No. 10/847,383, filed May 18, 2004, Ajioka et al.
U.S. Appl. No. 10/847,308, filed May 18, 2004, Ajioka et al.

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