Electronic component manufacturing method

Semiconductor device manufacturing: process – Making passive device – Trench capacitor

Reexamination Certificate

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Details

C438S221000, C438S242000, C438S266000, C438S393000, C438S396000, C257SE21585

Reexamination Certificate

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07879679

ABSTRACT:
A method for manufacturing an electronic component on a semiconductor substrate, including forming at least one opening in the substrate; forming in the bottom and on the walls of the opening and on the substrate an alternated succession of layers of a first material and of a second material, the second material being selectively etchable with respect to the first material and the substrate; trimming the layer portions of the first material and of the second material which are not located in the opening; selectively etching a portion of the first material to obtain trenches; and filling the trenches with at least one third material.

REFERENCES:
patent: 6399502 (2002-06-01), Hernandez et al.
patent: 7141866 (2006-11-01), Islam et al.
patent: 2004/0241939 (2004-12-01), Beintner et al.
patent: 2006/0110936 (2006-05-01), Hill et al.
Yamauchi S et al.:Influence Of Trench Etching On Super Junction Devices, fabricated by trench filling Power Semiconductor Devices and ICS, 2004. Proceedings. ISPSD 104. The 16thInternational Symposium on Kitakyushu Int. Conf. Ctr, Japan May 24-27, 2004, Piscataway, NJ, USA,IEEE, May 24, 2004, pp. 193-196, XPOI0723371 ISBN: 4-88686-060-5.
Hausmann D et al.:Rapid Vapor Deposition Of Highly Conformal Silica Nanolaminates, Science, American Association for the Advancement of Science US, vol. 298, No. 592, Oct. 11, 2002, pp. 402-406, XP002252801 ISSN: 0036-8075.

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