Electronic component including soldered electrical leads

Details Electronic component including soldered electrical leads Electronic component including soldered electrical leads

1984-08-31

1988-07-05

Buczinski, Stephen C.

Electricity: electrical systems and devices

Miscellaneous

174 94R, 338329, 338332, 361310, 22826313, H01R 900, H01C 1144, B23K 3522, H01R 400

Patent

active

H00004987

ABSTRACT:
Disclosed is an electronic component which includes soldered leads (30 and 31) for electrical connection to other components. The electronic component is typically a film or hybrid integrated circuit formed on an insulating substrate (10) which includes contact pads (20-23) on the periphery. Clip-on type leads (30 and 31) are soldered to these pads. The leads include a thin layer of nickel (36) formed at least in the jaw (32) of the clip-on lead to prevent the formation of brittle intermetallics by the interaction of solder components with the lead components.

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Johnson, Jr., "Technical Clip for Printed Circuit Board," IBM Technical Disclosure Bulletin, vol. 9, No. 10, p. 1306, (3/1967).
IBM Materials Laboratory Report No. 595-141, "Intermetallic Compounds and their Effect on Solder Joint Strengths," DCS Code 6-41-3663-01, File No. 595-141, (Jan. 1965).
D. Olsen et al, "Effects of Inter-metallics on the Reliability of Tin Coated Cu, Ag and Ni Parts", 13th Annual Proceedings of Reliability Physics Symposium, pp. 80-86 (Apr. 1975).
E. W. Brothers, "Intermetallic Compound Formation in Soft Solders," The Western Electric Engineer, vol. 25, No. 2, pp. 48-63 (Spring/Summer 1981).
H. N. Keller, "Significant Features of Solder Connections to Gold-Plated Thin Films," IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. CHMT-5, No. 4, pp. 408-419 (Dec. 1982).

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