Electronic component including conductor connected to electrode

Details Electronic component including conductor connected to electrode Electronic component including conductor connected to electrode

1995-07-11

1999-05-04

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Beam leads

257666, 257676, 257642, 257673, 257287, H01L 2350, H01L 2348, H01L 2984

Patent

active

059006714

ABSTRACT:
A semiconductor device and manufacturing method thereof capable of collectively bonding inner leads to a plurality of electrodes to make mechanically and electrically strong coupling therebetween. An insulating coat 2a, having a conductive property when being subjected to heating, is adhered onto a surface of a semiconductor chip 1 other than an electrode 2, and the tip portion of an inner lead 4a from a lead frame 4 is made to extend to cover the top surface of the electrode 2, before the inner lead 4a tip portion and the insulating coat 2a are anode-junctioned with each other so that the electrode 2 and the inner lead 4a are brought into contact with each other under pressure so as to be electrically coupled to each other.

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