Electronic component heat sink attachment using a canted coil sp

Details Electronic component heat sink attachment using a canted coil sp Electronic component heat sink attachment using a canted coil sp

1993-05-21

1995-03-28

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257726, 257719, 165185, H05K 720

Patent

active

054023130

ABSTRACT:
A thermal attachment assembly for heat generating electronic devices which uses a canted coil spring to apply pressure directly against electronic components. The attachment assembly includes a heat sink housing in which the electronic components are pressed against an electrically insulating, thermally conductive film positioned against a surface of a shoulder or side wall of the heat sink housing. The force of the canted coil spring can be counterbalanced by a cover for the housing, or by an abutment that is either fixed in the housing or floats between attachment and an assembly at each of opposite sides of the housing.

REFERENCES:
patent: 4993482 (1991-02-01), Dolbear et al.

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