Electronic component heat sink assembly

Details Electronic component heat sink assembly Electronic component heat sink assembly

1999-03-16

2000-04-25

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361701, 361709, 361713, 361714, 361719, 257706, 257712, 257721, 257722, 174 161, 174 163, 165 802, 165 803, H05K 720

Patent

active

060551585

ABSTRACT:
An electronic component heat sink assembly comprising a printed circuit board having electronic components; and a box surrounding the printed circuit board. The box has a first box member with a molded plastic frame and a heat transfer member connected to the molded plastic frame. The frame of the first box member can also form part of an electrical header connector. The heat transfer member extends through the molded plastic frame and has portions which extend from different sides of the molded plastic frame. The portions of the heat transfer member extend from a first one of the sides of the molded plastic frame and are thermally connected to the electronic components such that heat from the electronic components is transferred out of the box, through the molded plastic frame, by the heat transfer member.

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patent: 5469330 (1995-11-01), Karabatsos et al.
patent: 5801330 (1998-09-01), Gademann et al.
patent: 5812375 (1998-09-01), Casperson

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