Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2005-12-20
2005-12-20
Vu, Hung (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S686000, C257S696000, C257S777000, C438S109000, C438S123000
Reexamination Certificate
active
06977427
ABSTRACT:
An electronic component has a chip stack with a first semiconductor chip, a second semiconductor chip, and a large number of flat conductors configured in between the first semiconductor chip and the a second semiconductor chip. The flat conductors have a central section on which the semiconductor chips are mounted. First bonding connections connect the first semiconductor chip to inner sections of the flat conductors. Second bonding connections connect the second semiconductor chip to transitional sections of the flat conductors. The outer sections of the flat conductors project out of a package.
REFERENCES:
patent: 5539250 (1996-07-01), Kitano et al.
patent: 5691570 (1997-11-01), Kozuka
patent: 5804874 (1998-09-01), An et al.
patent: 6087718 (2000-07-01), Cho
patent: 6303981 (2001-10-01), Moden
patent: 6483181 (2002-11-01), Chang et al.
patent: 6593649 (2003-07-01), Lin et al.
patent: 197 47 105 (1998-07-01), None
patent: 100 03 670 (2001-08-01), None
patent: 74657 (2000-08-01), None
Hetzel Wolfgang
Thomas Jochen
Greenberg Laurence A.
Infineon - Technologies AG
Locher Ralph E.
Stemer Werner H.
Vu Hung
LandOfFree
Electronic component having stacked semiconductor chips in... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic component having stacked semiconductor chips in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component having stacked semiconductor chips in... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3507374