Electronic component having lead frame

Electricity: electrical systems and devices – Electrolytic systems or devices – Solid electrolytic capacitor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S531000, C361S308200

Reexamination Certificate

active

06972943

ABSTRACT:
An electronic component has a lead frame attached to an element with a conductive adhesive. The lead frame has one of a hole, cavity, cutout and groove filled with the adhesive. The lead frame may be provided with a plurality of grooves intersecting one another and divided into frame segments by the grooves.

REFERENCES:
patent: 6046902 (2000-04-01), Nakagawa et al.
patent: 6188566 (2001-02-01), Aoyama
patent: 6451622 (2002-09-01), Sawai
patent: 6473291 (2002-10-01), Stevenson
patent: 6751086 (2004-06-01), Matsumoto
patent: 6813141 (2004-11-01), Kuroyanagi
patent: 8-148392 (1996-06-01), None
patent: WO 00/55875 (2000-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electronic component having lead frame does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic component having lead frame, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component having lead frame will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3512823

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.