Electronic component having a thin-film structure with passive e

Details Electronic component having a thin-film structure with passive e Electronic component having a thin-film structure with passive e

1996-02-23

1998-03-24

Pascal, Robert

Wave transmission lines and networks

Coupling networks

Frequency domain filters utilizing only lumped parameters

3613063, 338216, H03H 706

Patent

active

057317470

ABSTRACT:
An electronic component with a substrate (1, 31) of which a surface (4, 34) is provided with a thin-film structure with passive elements (5, 35), with a resistor (6, 36) formed in a layer of resistor material (7, 37), and with a capacitor having a lower electrode (9, 39) formed in an electrode layer (10, 40) provided on the surface, a dielectric (11, 41) formed by a layer of insulating material (12, 41) provided on the lower electrode, and an upper electrode (13, 43) formed in an electrode layer (14, 44) provided on the dielectric. One of the electrodes (9, 43) of the capacitor (8, 38) is formed in an electrode layer (10, 44) which is constructed as a dual layer (19-21, 49-51), of which the layer of resistor material (7, 37) in which also the resistor (6, 36) is formed constitutes a first partial layer (19, 49), on which a layer of conductive material (20, 55) is provided which constitutes the other, second partial layer (21, 51). The capacitor has a comparatively low series resistance owing to the use of the dual layer.

REFERENCES:
patent: 3569872 (1971-03-01), Berlin
patent: 3868587 (1975-02-01), Nathan et al.
patent: 4302737 (1981-11-01), Kausche et al.
patent: 4342143 (1982-08-01), Jennings
patent: 4410867 (1983-10-01), Arcidiacomo et al.
patent: 4560963 (1985-12-01), Sharpe
Ohr, "Circular Design Improves Trim Factors of Thick-Film Resistors", Electronics Design 3, vol. 28, Feb. 1, 1980, p. 33.
"A Silicon-on-Silicon Multichip Module Technology with Integrated Bipolar Components in the Substrate", by Ray-Long Day et al, Proc. 1994 IEEE MCM Conference, MCMC-94, pp. 64-67. no month.

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