Electronic component handling apparatus and electronic...

Details Electronic component handling apparatus and electronic... Electronic component handling apparatus and electronic...

2005-01-11

2005-01-11

Osele, Mark A. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C156S583200, C438S464000, C438S976000

Reexamination Certificate

active

06841030

ABSTRACT:
An electronic-component handling apparatus includes a) an electronic-component retainer provided with an adhesive layer for retaining multiple electronic components by an adhesion force at the bottom surface thereof and b) a blade which is used for removing the electronic components from the adhesive layer. A driving mechanism moves the blade relative to the adhesive layer along the surface of the adhesive layer while forming a dent in the bottom surface of the adhesive layer by a tip of the blade.

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