Electronic component for surface mounting technology

Details Electronic component for surface mounting technology Electronic component for surface mounting technology

1996-05-16

1999-11-02

Paumen, Gary F.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

439910, H01R 909

Patent

active

059759208

ABSTRACT:
An electronic component for mounting on a PCB by a reflow soldering method has a conductor element mounted on an insulating component body, the conductor element having a contact region exposed on the exterior of the component body to connect the component to the PCB. In order to increase the numerical mounting density of such electronic components on the PCB a window is provided in the body of the component, which allows IR radiation to pass through the component body to the contact region of the conductor element.

REFERENCES:
patent: 4540232 (1985-09-01), Zibung
patent: 4990108 (1991-02-01), Sakaguchi
patent: 5096440 (1992-03-01), Katsumata
patent: 5169322 (1992-12-01), Frantz et al.
patent: 5203710 (1993-04-01), Miyazawa
patent: 5226825 (1993-07-01), Ricci, Jr. et al.
patent: 5281152 (1994-01-01), Takahashi et al.
patent: 5342220 (1994-08-01), Kodama
patent: 5547384 (1996-08-01), Benjamin
patent: 5607313 (1997-03-01), Nyman

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