Electronic component for surface mounting

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Reexamination Certificate

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Reexamination Certificate

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08053953

ABSTRACT:
An electronic component, which is surface-mounted on a wiring board by soldering, and in which the occurrence of cracks in the solder after surface-mounting is suppressed, may include: a member constituting at least part of a container and made of ceramic; and an external terminal provided on the outer surface of the member and used in surface-mounting the electronic component on the wiring board by solder. The film thickness of a layer constituting the external terminal is designed so that when the thermal expansion coefficient of the ceramic constituting the member is α1, combined expansion coefficient αkof the member and the external terminal satisfies a relation of 1.029≦αk/α1≦1.216. The external terminal preferably comprises a nickel layer as an electrode body.

REFERENCES:
patent: 5841217 (1998-11-01), Kizaki et al.
patent: 2005/0269911 (2005-12-01), Usuda
patent: 2007/0145863 (2007-06-01), Kusai
patent: 5-90954 (1993-12-01), None
patent: 2003-297453 (2003-10-01), None
patent: 2005-268580 (2005-09-01), None
patent: 2006-32645 (2006-02-01), None
patent: 2006-42096 (2006-02-01), None
patent: WO2005/109638 (2005-11-01), None
Kazuhiro Igarashi et al., “Analysis of Solder Joint Breakdown Life in Electronic Devices Mounted in Cars”, Toyota Technical Review, vol. 54 No. 1, Aug. 2005, pp. 142-143 with English Abstract.
International Search Report for International Patent Application No. PCT/JP2007/071685 mailed Dec. 11, 2007 with English Translation.
European Search Report for Application No. 07831416.8-1232/2091078 mailed Feb. 19, 2010.

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