Electronic component for aligning a light transmitting structure

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

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385 90, 385 92, G02B 636

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058839968

ABSTRACT:
An electronic component (10) for aligning a light transmitting structure (19) such as an optical fiber or a waveguide, includes a semiconductor substrate (11) which contains or supports at least one semiconductor device (12). To provide electrical isolation and mechanical protection for the semiconductor device (12), a passivation layer (25) is disposed over the semiconductor substrate (11). At least one alignment feature (14) for the light transmitting structure (19) is provided over the passivation layer (25) and over the semiconductor device (12). The alignment feature (14) is manufactured simultaneously during a flip chip bump process which eliminates the necessity for extra processing steps while providing additional alignment functionality.

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Components, Hybrids & Manufacturing Technology Society IEEE; 45th Electronic Components & Technology Conference 1995; IEEE Catalog No. 95CH3582-0; Schwartz et al., Shun Meen Kuo, Stephen G. Shook, and Brian Webb; "A Low Cost, High Performance Optical Interconnect"; pp. 376-379. No month.

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