Electronic-component feeding device

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S740000, C029S744000, C196S139000, C196S139000, C226S076000, C226S061000, C226S067000, C414S416040

Reexamination Certificate

active

11231965

ABSTRACT:
Disclosed is an electronic-component mounting apparatus1for mounting a plurality of electronic components onto a printed-wiring board10, which comprises a component mounting head4adapted to suck up the electronic component and mount the sucked up electronic component on the printed-wiring board10while moving along an X-axis direction, a table8adapted to move the printed-wiring board10along a Y-axis direction, an electronic-component feeding device12, 14attached to the table8and adapted to move in sync with the movement of the printed-wiring board10,and component image-recognition/correction means16for correcting a posture of the electronic component in accordance with image recognition of the posture, during the time between the sucking up and mounting of the electronic component by the component mounting head, wherein respective positions of the sucking of the electronic component, the mounting of the electronic component and the image recognition are located on the X-axis. The disclosed electronic-component feeding device includes a rectangular-pipe type and a plate type.

REFERENCES:
patent: 4250615 (1981-02-01), Knuth et al.
patent: 4459743 (1984-07-01), Watanabe et al.
patent: 6296104 (2001-10-01), Ito et al.
patent: 61-63094 (1986-04-01), None
patent: 01-292897 (1989-11-01), None
patent: 03-024795 (1991-02-01), None
patent: 04-114886 (1992-04-01), None
patent: 07-030287 (1995-01-01), None
patent: 07-030292 (1995-01-01), None
patent: 07-061556 (1995-03-01), None
patent: 10-022688 (1998-01-01), None
patent: 10-294598 (1998-11-01), None
patent: 11-317599 (1999-11-01), None

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