Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Patent
1994-01-03
1996-09-17
Thomas, Laura
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
361816, H05K 900
Patent
active
055570631
ABSTRACT:
Improved RF shielding is disclosed. The shielding provides a joint seal that can eliminate the soldering, and the screws and gaskets, otherwise required for securing RF shield caps and walls to reduce EMI. Conductive shield caps that can be simply snap fit against the groundplane are also disclosed.
REFERENCES:
patent: 2379322 (1945-06-01), Tierney, Jr.
patent: 3296356 (1967-01-01), McAdams
patent: 3304360 (1967-02-01), Hadley et al.
patent: 4688148 (1987-08-01), Mallory et al.
patent: 4831498 (1989-05-01), Baba
patent: 5170009 (1992-12-01), Kadokura
patent: 5398156 (1995-03-01), Steffes et al.
Horgan Christopher
Lucent Technologies - Inc.
Thomas Laura
LandOfFree
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