Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-08-29
2000-08-29
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257712, 257717, 257794, H01L 2334
Patent
active
061113166
ABSTRACT:
An electronic component (10) is formed by encasing individual components within a glass tube (20). The individual components can include a semiconductor die (11), leads (12,13), and dumets (16,17). The glass tube (20) is transparent and melts at a temperature less than other commercially available materials.
REFERENCES:
patent: 3361589 (1968-01-01), Garceau
patent: 3723835 (1973-03-01), Davis et al.
patent: 3844029 (1974-10-01), Dibugnara
patent: 3945111 (1976-03-01), Greeson et al.
patent: 3950142 (1976-04-01), Brenan et al.
patent: 3964920 (1976-06-01), Davis et al.
patent: 3987217 (1976-10-01), Greeson et al.
patent: 3996602 (1976-12-01), Goldberg et al.
patent: 4042951 (1977-08-01), Robinson et al.
patent: 4059837 (1977-11-01), Suzuki et al.
patent: 4131478 (1978-12-01), Davis et al.
patent: 4146655 (1979-03-01), Davis et al.
patent: 5164813 (1992-11-01), Blackstone et al.
patent: 5623167 (1997-04-01), Tabuchi
patent: 5942793 (1999-08-01), Senoo et al.
patent: 5946586 (1999-08-01), Pukala
Darbha Sury N.
Jang Myungseok
Jung Kyu Jin
Kaercher Austin S.
Chambliss Alonzo
Chaudhuri Olik
Martinez Anthony M.
Motorola Inc.
LandOfFree
Electronic component encapsulated in a glass tube does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic component encapsulated in a glass tube, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component encapsulated in a glass tube will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1252822