Electronic component embedded substrate and method for...

Details Electronic component embedded substrate and method for... Electronic component embedded substrate and method for...

2005-07-27

2008-09-02

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S761000, C029S841000

Reexamination Certificate

active

07420128

ABSTRACT:
An electronic component embedded substrate and a method for manufacturing the substrate are disclosed. The electronic component embedded substrate includes a substrate main body and an electronic component embedded in the substrate main body. The center plane of the electronic component in the thickness direction thereof and the center plane of the substrate main body in the thickness direction thereof generally match each other.

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patent: 2003/0116843 (2003-06-01), Iijima et al.
patent: 2004/0001324 (2004-01-01), Ho et al.

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