Electronic component, electro-optical device, and electronic...

Details Electronic component, electro-optical device, and electronic... Electronic component, electro-optical device, and electronic...

2008-09-30

2008-09-30

Ngo, Hung V (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C257S780000, C257S738000

Reexamination Certificate

active

11332878

ABSTRACT:
Provided is an electronic component including a pad provided on an active surface of a rectangular chip substrate, a resin protrusion provided along sides of the chip substrate, and a conductive portion which is electrically connected to the pad and which is formed out of a conductive film covering the surface of the resin protrusion. The resin protrusion includes a protruded body extending linearly and a plurality of the resin protrusions are provided on at least one side of the chip substrate to form a clearance in an intermediate portion of the side.

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