Electronic component detection system

Image analysis – Applications – Manufacturing or product inspection

Reexamination Certificate

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Details

C382S149000

Reexamination Certificate

active

07551765

ABSTRACT:
The present invention provides a method and a system for determining whether a target component of an electronic assembly is assembled correctly. The method of the present invention involves correlating the view of a test electronic assembly with both a positive control image and a negative control image. The positive control image is an image of an electronic assembly that has been assembled properly, whereas the negative control image is an image of an electronic assembly that has been assembled improperly. If the correlation between the test image and the positive control image is greater than the correlation between the test image and the negative control image, the test assembly is assembled properly. On the other hand, if the correlation between the test image and the negative control image is greater than the correlation between the test image and the positive control image, the test assembly is assembled improperly.

REFERENCES:
patent: 6137893 (2000-10-01), Michael et al.
patent: 6701003 (2004-03-01), Feinstein
patent: 6748104 (2004-06-01), Bachelder et al.
patent: 2002/0186878 (2002-12-01), Hoon et al.

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