Electronic component cooling system

Details Electronic component cooling system Electronic component cooling system

1997-05-07

1999-12-14

Lazarus, Ira S.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

165 803, 361724, 361384, 174 16R, F28D 1500

Patent

active

060004649

ABSTRACT:
An electronic component cooling system for printed circuit board enclosures includes a plurality of fans, each coupled to an air deflection unit which selectively forces air from the fans through the printed circuit boards. The system includes at least one thermal diffuser and at least one air concentrator. The thermal diffuser is placed between a stack of two or more shelving units to avoid the development of hot spots or dead zones. The air concentrator provides the ability for certain components which have a high heat output to receive a greater amount of air flow than other components which have lower heat outputs.

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