Electronic component cooling arrangements

Details Electronic component cooling arrangements Electronic component cooling arrangements

1979-06-22

1981-11-03

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361415, 361399, H05K 720

Patent

active

042989035

ABSTRACT:
An arrangement for cooling electronic components mounted on a card (41) wherein the card is carried in a heat conductive frame (17) which is urged by spring bias means (25) along a guide arrangement (21) provided in an open ended structure (13) so that the frame is in good thermal contact with a cold wall (11) to which the open end of the structure is held in releasable contact to form a housing for the frame.

REFERENCES:
patent: 3364395 (1968-01-01), Donofris
patent: 3631325 (1971-12-01), Wenz
patent: 3662224 (1972-05-01), Rauch
patent: 3678342 (1972-07-01), Shaw
patent: 3760233 (1973-09-01), Warwick
patent: 4193444 (1980-03-01), Boyd
"Heat Transfer Structure . . . ," Jackson and Stout, IBM Tech. Discl. Bull., vol. 13, No. 12, May 1971, pp. 3644, 3645.
Adjustible Cold Plate Chip Cooling, Gupta, IBM Tech. Discl. Bull., vol. 20, No. 3, Aug. 1977, p. 1120.

Affiliated with

Also associated with

Rating

Electronic component cooling arrangements does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic component cooling arrangements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component cooling arrangements will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1067423