Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-09-25
2002-11-12
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S694000, C361S695000, C361S703000, C361S704000, C361S709000, C257S718000, C257S722000, C257S727000, C174S015100, C174S016100, C174S016300, C165S080300, C165S104330
Reexamination Certificate
active
06480383
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention relates to an electronic component cooling apparatus for cooling an electronic component such as an MPU or the like, and more particularly to an electronic component cooling apparatus of the type that a heat sink on which an electronic component is mounted is forcibly cooled by air fed from a fan unit.
An electronic component cooling apparatus which has a heat sink including a plurality of radiation fins arranged so as to be spaced from each other at intervals while being parallel to each other incorporated therein has been conventionally known in the art, as disclosed in U.S. Pat. Nos. 5,309,983, 5,519,574 (see
FIG. 3
of the patent), U.S. Pat. No. Design 403,760, U.S. Pat. Nos. 5,494,098 and 5,835,347. The conventional electronic component cooling apparatus as shown in the above cases, is constructed so as to discharge air in both directions in which each of the radiation fins extends.
Another conventional electronic component cooling apparatus is disclosed in U.S. Pat. No. 5,740,014, which is so constructed that a plurality of parting slits are formed so as to be perpendicular to all of radiation fins arranged on a base of a heat sink in a manner to be parallel to each other, to thereby divide the radiation fins into fine plate-like strips. Then, air is blown against the strips from an axial fan to increase cooling efficiency of the electronic component cooling apparatus. Also, in the electronic component cooling apparatus, the radiation fins arranged in parallel to each other are entirely or substantially entirely contacted at an end thereof with a top plate of a fan unit mounting frame for mounting a fan unit thereon.
A further conventional electronic component cooling apparatus is disclosed in U.S. Pat. Nos. 5,615,998 and Des. 403,760. The cooling apparatus disclosed includes an engagement structure which permits a plurality of engaging sections provided on a casing of a fan unit and a plurality of engaged sections provided on a heat sink to be engaged with each other by merely approaching the casing of the fan unit to the heat sink when the fan unit is mounted on the heat sink.
Still another conventional electronic component cooling apparatus is proposed as disclosed in Japanese Patent Application Laid-Open Publication No. 284116/1999. The cooling apparatus disclosed is so constructed that an end of each of plural radiation fins and a top plate of a fan unit mounting frame for mounting a fan unit thereon are arranged so as to be spaced from each other at a predetermined interval to define an air flow space therebetween.
Currently, an electronic equipment such as a CPU or the like generally tends to generate more heat than before, and it is highly required to enhance cooling performance of an electronic component cooling apparatus. To this end, it is proposed that radiation fins each are made of a copper plate relatively reduced in thickness which exhibits enhanced thermal conductivity. However, when the radiation fins are arranged so as to provide an interval between the radiation fins and a top plate of a fan unit mounting frame for mounting a fan unit thereon while being reduced in thickness, the radiation fins fail to be positively used as a support for the frame. This is solved by rendering a mechanical structure of the fan mounting frame rigid. However, an increase in rigidity of the mechanical structure of the fan mounting frame leads to an increase in manufacturing cost of the frame, leading to a failure in demand for cost reduction.
SUMMARY OF THE INVENTION
The present invention has been made in view of the foregoing disadvantage of the prior art.
Accordingly, it is an object of the present invention to provide an electronic component cooling apparatus which is capable of firmly fixing a fan unit mounting frame to a heat sink, when radiation fins of the heat sink are not intended to be positively used as a support for the fan unit mounting frame.
It is another object of the present invention to provide an electronic component cooling apparatus which is capable of firmly fixing a fan unit mounting frame to a heat sink without increasing mechanical strength of the fan unit mounting frame.
It is a further object of the present invention to provide an electronic component cooling apparatus which is capable of changing a cooling performance thereof depending on a variation in temperature.
It is still another object of the present invention to provide an electronic component cooling apparatus which is capable of exhibiting enhanced heat dissipating performance as compared with heretofore.
It is yet another object of the present invention to provide an electronic component cooling apparatus which is capable of facilitating position ing between a fan unit mounting frame and a heat sink and ensuring firm engagement therebetween, not permitting the engagement to come off easily.
In accordance with the present invention, an electronic component cooling apparatus is provided. The electronic component cooling apparatus includes a heat sink, a fan unit and a fan unit mounting frame made of a synthetic resin material for mounting the fan unit on the heat sink. The heat sink includes a radiation fin unit including a plurality of radiation fins made of a material increased in thermal conductivity, as well as a base made of a material increased in thermal conductivity. The base is mounted on a front surface thereof with the radiation fin unit and on a rear surface thereof with an electronic component to be cooled. The radiation fins are arranged so as to extend in a first direction perpendicular to the front surface of the base and in a second direction perpendicular to the first direction and along the front surface of the base. The radiation fins are arranged so as to be spaced from each other at predetermined intervals in a third direction perpendicular to the first and second directions. The radiation fins each are fixed, to the base, at an end thereof positioned on one side in the first direction. The base is formed with a hook engagement at each of a pair of edges thereof positioned on both sides in the third direction.
The fan unit incorporated in the electronic component cooling apparatus feeds air for cooling the radiation fin unit. The fan unit includes an impeller including a plurality of blades and rotated by a motor and is arranged on the other side in the first direction mentioned above with respect to the radiation fin unit. The fan unit mounting frame for mounting the fan unit on the heat sink includes a top plate for supporting the fan unit thereon, a pair of side plates and at least a pair of mounting legs. The top plate is arranged outside the radiation fin unit so as to define a gap sufficient to provide an air flow space continuously extending on both sides in the second and third directions between the top plate and an end of each of the radiation fins positioned on the other side in the first direction. The top plate is provided with an air guide hole for guiding air sucked by the fan unit to the air flow space. The side plates are arranged so as to extend, toward the base, from a pair of ends of the top plate positioned on both sides in the third direction. The mounting legs each are connected at one end thereof to each of the side plates and provided at the other end thereof with a hook engaged with each of the hook engagements. The side plates and mounting legs are formed into a shape and dimensions which keep the side plates and mounting legs from fully covering side surfaces of the radiation fan unit positioned on both sides in the third direction.
The fan unit mounting frame includes a first pivotal movement preventing engagement structure which is engaged with the radiation fin unit to prevent the top plate from pivotally moving in the third direction and a second pivotal movement preventing engagement structure which is engaged with the radiation fin unit to prevent the top plate from pivotally moving in the second direction.
The above-described construction of the present invention permits air for coolin
Ishiwatari Naoko
Kodaira Yuichi
Maruyama Haruhisa
Chervinsky Boris
Rankin, Hill Porter & Clark LLP
Sanyo Denki Co. Ltd.
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