Electronic component contained substrate

Details Electronic component contained substrate Electronic component contained substrate

2011-01-18

2011-01-18

Dinh, Tuan T (Department: 2841)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C361S786000, C361S761000

Reexamination Certificate

active

07872359

ABSTRACT:
An electronic component contained substrate in which an electronic component is mounted between a pair of wiring substrates, wherein the wiring substrates are connected electrically via solder balls, an opening portion opened larger than a planar shape of the electronic component is formed in the other wiring substrate, which faces to one wiring substrate on which the electronic component is mounted, in a position that opposes the electronic component, and a space between a pair of wiring substrates is sealed with a sealing resin.

REFERENCES:
patent: 6335565 (2002-01-01), Miyamoto et al.
patent: 6982491 (2006-01-01), Fan et al.
patent: 2002/0127771 (2002-09-01), Akram et al.
patent: 2003/0098502 (2003-05-01), Sota
patent: 2003-347722 (2003-12-01), None

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