Electronic component contained in a metal package

Details Electronic component contained in a metal package Electronic component contained in a metal package

1996-05-30

1998-05-26

Gensler, Paul

Wave transmission lines and networks

Long line elements and components

Strip type

174 526, 361752, H01P 100, H05K 504

Patent

active

057572518

ABSTRACT:
In an electronic component, an electronic circuit board having an electronic element mounted on the major surface is mounted on a metal frame. The electronic circuit board is covered with a metal lid fitted on the metal frame and contained in a metal package constituted by the metal frame and the metal lid. At least at one notched portion is formed at least at one end of the electronic circuit board. A positioning projection formed on the metal frame engages with the notched portion. The mechanical precision and electrical characteristics are improved, so that an electronic component particularly excellent in high-frequency characteristics, which can be manufactured in simple manufacturing process, can be obtained.

REFERENCES:
patent: 4135168 (1979-01-01), Wade
patent: 4227036 (1980-10-01), Fitzgerald
patent: 4310870 (1982-01-01), Kia et al.
patent: 4811168 (1989-03-01), Chesnut et al.
patent: 5034846 (1991-07-01), Hodge et al.
patent: 5285354 (1994-02-01), Ohsawa et al.
patent: 5545848 (1996-08-01), Lin

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