Electronic component comprising a cooling surface

Details Electronic component comprising a cooling surface Electronic component comprising a cooling surface

2004-09-01

2009-12-15

Fahmy, Wael (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257S660000, C257SE23114, C257SE23118

Reexamination Certificate

active

07633158

ABSTRACT:
An electronic component comprising at least two connection elements (2,7,8), each provided with at least one contact surface (13.1, 13.2, 13.3, 9, 10) which is used to fix the electronic component (1) to a surface of a printed circuit board. An at least partially plane cooling surface is formed on the first connection element (2), for placing on a cooling body that is oriented in the direction of the side of the electronic component (1) opposing the printed circuit board. The first connection element (2) has at least one raised area (3.1, 3.2, 3.3) on the side thereof facing the printed circuit board, on which the contact surface (13.1, 13.2, 13.1) of the first connection element (2) is formed. Said first connection element (2) also has at least one recessed area (4, 4′) in which the at least one other connection element (7, 7′; 8, 8′) is arranged.

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“The RF MOSFET Line, RF Power Field Effect Transistor,” Motorola Semiconductor Technical Data, 2002.

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