Electronic component chip holder including two adhesive surfaces

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture

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428343, 428156, 428137, 428167, 428909, 118423, 118428, 118500, 414941, 269903, 29740, 206710, 206713, H01L 2168

Patent

active

055715940

ABSTRACT:
In order to properly hold a number of miniaturized electronic component chips so that processing such as formation of external electrodes can be efficiently performed, a holder having an adhesive face to be stuck to first end surfaces of a number of electronic component chips for holding the electronic component chips is employed. The number of electronic component chips being held by the holder are dipped in electrode paste, so that external electrodes are formed on second end surfaces thereof. Then, an adhesive face of another holder having stronger adhesion than the adhesive face of the first holder is stuck to the electronic component chips, whereby the number of electronic component chips are simultaneously transferred to this holder. The first end surfaces are then also dipped in electrode paste to form external electrodes thereon.

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