Electronic component cap and seal

Details Electronic component cap and seal Electronic component cap and seal

1983-03-28

1985-02-12

Grimley, A. T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H05K 506

Patent

active

044993331

ABSTRACT:
A cap and seal including a central cap (20) to be positioned over an electronic component such as an integrated circuit chip (12), has a spaced upstanding wall or dam (22) which may be staked to the circuit board in assembly forming with the peripheral side wall (21) of the cap a channel or moat (19). Bridging means (24) extend between wall (21) and wall (22) onto which is placed a preform ring (30) of solid sealant material. Heating of the assembly, more particularly ring (30), allows melted sealant material to flow under and around bridging means (24) to form a confined seal between wall (21), wall (22) and an annular surface (29) on the circuit board surrounding cap wall (21).

REFERENCES:
patent: 3404215 (1968-10-01), Burk et al.
patent: 3495023 (1970-02-01), Hessinger et al.
patent: 3693252 (1972-09-01), Robertson et al.
Cameron, "Installation of Chips on Printed Circuit Boards", IBM Technical Disclosure Bulletin, vol. 11, No. 8, Jan. 1969, p. 971.

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