Stock material or miscellaneous articles – All metal or with adjacent metals – Having marginal feature for indexing or weakened portion for...
Patent
1981-01-13
1984-03-20
Rutledge, L. Dewayne
Stock material or miscellaneous articles
All metal or with adjacent metals
Having marginal feature for indexing or weakened portion for...
428596, 357 70, H01L 2348
Patent
active
044381816
ABSTRACT:
A preformed metallic tape for thermocompression bonding to electronic component chips and a method and apparatus for the use thereof. The tape has etched thereinto a chip bonding site which includes a central, pull-tab region surrounded by a frame region. Intermediate the pull-tab and the frame regions, electrically conductive leads are formed and connected to the pull-tab. Several of the leads are further connected to the frame. The leads are formed with neck regions located respectively between their ends and the pull-tab and frame. One surface of the tape is a bonding surface and the opposite surface is a pressure pad surface. Protruding above the pressure pad surface are a plurality of mushroom-shaped pressure pads located respectively at the ends of leads. The tape is bonded to a chip by first aligning mating electrical contact pads thereof and terminal ends of the leads. The pads are then urged into the tape so that the pressure pads located on the opposite side thereof contact a heated anvil. Thus, the leads and chip pads are heated and softened permitting a force applied thereto by the pressure pads to form an electrically conductive bond therebetween. The same process may then be used to bond the other ends of the leads to either a lead frame or a chip carrier frame. The leads may then be electrically isolated by first adhering an adhesive tape to the exposed surface of the pull-tab region. Withdrawal of the tape then breaks the leads at their respective neck regions.
REFERENCES:
patent: 3440027 (1969-04-01), Hugle
patent: 3698074 (1972-10-01), Helda
patent: 3803709 (1974-04-01), Beltz
patent: 3821785 (1974-06-01), Rose
patent: 3832769 (1974-09-01), Olyphant
patent: 3838984 (1974-10-01), Crane
patent: 3868724 (1975-02-01), Perrino
patent: 3902148 (1975-08-01), Drees
patent: 4209355 (1980-06-01), Burns
patent: 4210926 (1980-07-01), Hacke
patent: 4259436 (1981-03-01), Tabuchi
patent: 4308339 (1981-12-01), Lindberg
patent: 4312926 (1982-01-01), Burns
patent: 4331831 (1982-05-01), Ingram
Rutledge L. Dewayne
Schreiber Donald E.
Schroeder Jon M.
Zimmerman J. J.
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