Electronic component attaching tool

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S741000, C029S742000, C029S743000, C438S108000

Reexamination Certificate

active

07430798

ABSTRACT:
An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

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Japanese Office Action dated Jan. 8, 2008 issued in corresponding Japanese Patent Application No. 2002-273676.

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