Electronic component assembly having an encapsulation material a

Details Electronic component assembly having an encapsulation material a Electronic component assembly having an encapsulation material a

1997-05-30

1998-09-15

Phillips, Michael W.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361764, 361762, 361783, 361710, 361765, 361772, 361767, 257787, 257784, 257723, 257783, 257676, 257700, 257735, 257736, 439 66, 439 91, H05K 118

Patent

active

058088733

ABSTRACT:
An electronic component assembly (10) is formed by mounting an electronic component (31) to a substrate (11). An encapsulating material (33) is used to protect the electronic component (31) from environmental hazards. The encapsulating material (33) is formed by dispensing an encapsulating fluid over the electronic component (31). A trench (36) is formed in a masking layer (21) on a substrate (11) to stop the flow of the encapsulating fluid. The trench (36) provides an edge (35) which acts as a discontinuity in the surface (23) of the masking layer (21). This discontinuity is sufficient to control the flow of the encapsulating fluid until the encapsulating fluid is cured to form the encapsulating material (33).

REFERENCES:
patent: 5239198 (1993-08-01), Lin et al.
patent: 5455456 (1995-10-01), Newman
patent: 5468784 (1995-11-01), Yanagawa et al.
patent: 5468999 (1995-11-01), Lin et al.
patent: 5652463 (1997-07-01), Weber et al.

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