Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-05-19
1999-04-20
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257712, 257796, 257675, 257717, 257719, 257720, H01L 2334, H01L 23495
Patent
active
058959734
ABSTRACT:
An aligned electronic circuit component assembly for attaching components onto larger mounting members at predetermined positions thereon are provided. The mounting or heat spreader members include shift resistant regions which are disposed in close proximity or substantially aligned with peripheral portions or edges of the component die when the die is placed in its predetermined position on an associated mounting or base member. The shift resistant regions can include non-linear edge surfaces, such as the edge surfaces around notches in the members, so as to provide areas on the base or heat spreader member which do not have solder thereon. It has been found that the surface tension of the liquid solder during reflow acts to provide a restraining force at the edge surfaces so as to restrain the electronic component from shifting from the desired position on the base member. In addition, the notches are formed in a pattern around the base heat spreader member which keeps them to a minimum number so that the heat spreader is large enough to ensure proper heat dissipation from the circuit component while still restraining shifting of the component, either rotationally about an axis extending through the component or translationally across the layer of liquid solder. Accordingly, efficient high volume production of precisely aligned circuit component assemblies including component dies attached on base members at predetermined positions thereon can occur utilizing a solder reflow process.
REFERENCES:
patent: 5602720 (1997-02-01), Natsuhara et al.
patent: 5629562 (1997-05-01), Nomura et al.
patent: 5721455 (1998-02-01), Takashita
Clark Jhihan B.
Delco Electronics Corp.
Funke Jimmy L.
Saadat Mahshid
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