Electronic component assembly and method for low cost EMI and ca

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361792, 361818, 257738, 257780, 174 35MS, 174 524, H05K 720

Patent

active

060116919

ABSTRACT:
The present invention is directed to an electronic component assembly which cost effectively eliminates capacitive coupling while providing significant heat transfer. Exemplary embodiments ensure that the circuit ground of electrical circuits on printed wiring boards and the chassis ground remain separate so that undesired ground loops are not created and so that a Faraday shield or "cage" can be established around all circuit elements to reduce EMI effects on the circuit.

REFERENCES:
patent: 4878152 (1989-10-01), Sauzade et al.
patent: 4882454 (1989-11-01), Peterson et al.
patent: 5195021 (1993-03-01), Ozmat et al.
patent: 5251099 (1993-10-01), Goss et al.
patent: 5347091 (1994-09-01), Schroeder
patent: 5353191 (1994-10-01), Volz et al.
patent: 5366027 (1994-11-01), Turek et al.
patent: 5432303 (1995-07-01), Turek et al.
patent: 5463530 (1995-10-01), DeGree
patent: 5495394 (1996-02-01), Kornfeld et al.
patent: 5510958 (1996-04-01), Shimabara et al.
patent: 5586011 (1996-12-01), Alexander
patent: 5639989 (1997-06-01), Higgins

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electronic component assembly and method for low cost EMI and ca does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic component assembly and method for low cost EMI and ca, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component assembly and method for low cost EMI and ca will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1077440

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.