Electronic component and substrate unit

Details Electronic component and substrate unit Electronic component and substrate unit

2006-08-01

2011-10-04

Nguyen, Hoa C (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S263000, C361S760000, C361S767000, C361S768000, C361S770000, C361S786000

Reexamination Certificate

active

08030578

ABSTRACT:
The present invention is an electrode10so provided as to be soldered to an electronic component12and, when the electronic component12is mounted on a substrate13, soldered to the substrate13. The electrode10includes a column-like electrode body11soldered to the electronic component12and to the substrate13. The electrode has grooves as an air discharging device discharging the air15ain air voids15generated within the solder14between joint surfaces11a,11bof the electrode body11and the electronic component12or the substrate13when the electrode body11is soldered to the electronic component12or the substrate13.

REFERENCES:
patent: 5400948 (1995-03-01), Sajja et al.
patent: 5798146 (1998-08-01), Murokh et al.
patent: 6409069 (2002-06-01), Harada et al.
patent: 6536105 (2003-03-01), Sakai et al.
patent: 6552277 (2003-04-01), Downes
patent: 6555052 (2003-04-01), Soga et al.
patent: 6562505 (2003-05-01), Tsukuda et al.
patent: 6590287 (2003-07-01), Ohuchi
patent: 6623283 (2003-09-01), Torigian et al.
patent: 6774490 (2004-08-01), Soga et al.
patent: 6940023 (2005-09-01), Ishizuka et al.
patent: 2002/0066583 (2002-06-01), Soga et al.
patent: 2002/0124228 (2002-09-01), Madni
patent: 2003/0186072 (2003-10-01), Soga et al.
patent: 2004/0262040 (2004-12-01), Ishizuka et al.
patent: 9-162220 (1997-06-01), None
patent: 10-154601 (1998-06-01), None
patent: 11-102820 (1999-04-01), None
patent: 11-345824 (1999-12-01), None
patent: 11-345826 (1999-12-01), None
patent: 2002-84055 (2002-03-01), None
patent: 3341715 (2002-08-01), None
patent: 2005-142497 (2005-06-01), None
patent: 451359 (2001-08-01), None
patent: 556465 (2003-10-01), None
patent: I228439 (2005-01-01), None
Office Action dated Mar. 3, 2009 corresponding to Taiwan Patent Application No. 095127740.
Japanese Notice of Reason for Rejection, English-language translation, mailed Dec. 7, 2010 for corresponding Japanese Application No. 2006-032164.
“JP Office Action”, mailed by JPO and corresponding to Japanese application No. 2006-032164 on Mar. 1, 2011, with English translation.

Affiliated with

Also associated with

Rating

Electronic component and substrate unit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic component and substrate unit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component and substrate unit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4289059