Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate
2004-02-27
2008-09-02
Sefer, Ahmed (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
With peripheral feature due to separation of smaller...
C257S501000, C257S513000, C257S520000, C257S621000, C257SE23062, C257SE25013
Reexamination Certificate
active
07420262
ABSTRACT:
The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semiconductor chip separated from such a semiconductor wafer constitutes an electronic component with external contacts in the form of edge contacts. Such an electronic component of semiconductor chip size can be used in diverse ways.
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Bauer Michael
Bemmerl Thomas
Fink Markus
Fürgut Edward
Jerebic Simon
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
Sefer Ahmed
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