Electronic component and panel and method for producing the...

Details Electronic component and panel and method for producing the... Electronic component and panel and method for producing the...

2006-04-25

2006-04-25

Le, Thao P. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S683000, C257S685000, C257S787000

Reexamination Certificate

active

07034383

ABSTRACT:
The invention relates to an electronic component and a panel, the electronic component having a semiconductor chip with a wiring board and a plastic package. The plastic package is made up of two layers of plastic package molding compound arranged one on top of the other. These layers are created with the aid of a printing operation under normal atmosphere.

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patent: 2000299341 (2000-10-01), None

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