Electronic component and package

Details Electronic component and package Electronic component and package

2005-03-08

2005-03-08

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S050510, C257S699000

Reexamination Certificate

active

06864424

ABSTRACT:
An electronic component includes: a package that includes a metal portion formed by pressing a metal, and an insulating portion attached to the metal portion through fusing; a chip housed in the package; first external terminals that are electrically connected to the chip with metal wires, and are partially embedded in the insulating portion; and ground terminals that are convexities of metal portion and are electrically connected to the chip with metal wires, connecting points between the first external terminals and the chip being located at the same height as connecting points between the ground terminals and the chip.

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patent: 5872331 (1999-02-01), Ando et al.
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patent: 6487085 (2002-11-01), Kimura et al.
patent: 6518501 (2003-02-01), Kawahara et al.
patent: 6777612 (2004-08-01), Sugiura et al.
patent: 7-336186 (1995-12-01), None
patent: 2001-60842 (2001-03-01), None

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