Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
1999-06-11
2002-08-06
Cuneo, Kamand (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S050510, C174S260000, C029S833000
Reexamination Certificate
active
06429387
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates to an electronic component having electrical connecting portions such as solder bumps or electrodes (lands, for example) exemplified by a solder bump component of a BGA (Ball Grid Array) type semiconductor component package (referred to as a BGA component hereinafter) represented by a CSP (Chip Size Package) or an electronic component such as QFP in forming an electronic circuit and relates to the mounting method and apparatus thereof.
2. Description of Related Art
In recent years, personal computers, portable telephones, information communications devices, multimedia electronic equipment, and the like have been compacted and provided with improved functions. Further, the electronic components and printed boards constituting electronic circuits have been made to have higher densities and finer constructions due to higher frequencies, and the mounting of components having a plurality of pins go mainstream in conformity to high-density circuits of QFP (Quad Flat Package) and the like. However, on increasing the density, the lead pitch of the connecting portions has been reduced in stages, for example, from 0.5 mm through 0.3 mm to the extent of 0.2 mm, for which the mounting method and manufacturing method themselves have become hard to be achieved.
It is further demanded for electronic circuits to cope with the reduction in size, higher functions, and higher frequencies, and this leads to a great desire to effectively mount printed boards with electronic components having solder bumps such as BGA (Ball Grid Array) represented by bare ICs of narrower lead pitches and CSP (Chip Size Package) and the like.
FIG. 15
is a front view schematically showing the land patterns of a QFP component and BGA components having solder bumps on a printed board.
FIG. 16A
is a sectional view of the BGA component having these solder bumps and the printed board to be mounted with the BGA component, while
FIG. 16B
is a bottom view of the BGA component. In FIG.
15
and
FIGS. 16A and 16B
, reference numeral
1
denotes a printed board,
2
BGA component connecting lands,
2
′ QFP connecting lands,
3
BGA component use board recognition marks,
3
′ QFP use board recognition marks,
4
BGA component land patterns,
4
′ a QFP land pattern,
5
a BGA component that serves as an electronic component,
6
a bump-shaped solder connecting portions (referred to as BG connecting portions hereinafter) that serves as portions to be electrically connected via solder bumps
7
to the circuit board electrodes, and
7
the solder bumps.
There is further known a component mounting apparatus as shown in the partially see-through perspective view of
FIG. 17
as a principal implement of a mounting position determining method of the component mounting apparatus. In
FIG. 17
, reference numeral
10
denotes a component mounting apparatus,
11
an operating section,
12
a control section,
13
a mounting head,
14
a mounting table,
15
a conveyance rail, and
16
a component supplying section. The component mounting apparatus
10
shown in
FIG. 17
is mounted with the sliding component supplying section
16
and an X-Y table that serves as the mounting table
14
for holding and positioning a printed board.
FIG. 18
is a partially see-through perspective view of another component mounting apparatus. In
FIG. 18
, reference numeral
10
denotes a component mounting apparatus,
11
an operating section for executing inputting and outputting for the execution of a mounting program of NC data or the like,
12
a control section for controlling the whole mounting process by recognition, calculation, and various instructions in mounting components,
13
a mounting head for holding the component to be mounted and mounting the component on the board,
13
a
a component inspecting section for inspecting the component held by the mounting head,
13
b
a board recognizing section for recognizing the position of the board conveyed to the board mounting table,
14
a mounting table for holding the board that is conveyed so as to be mounted with the component,
15
a conveyance rail for conveying the board with respect to the mounting table
14
,
16
a component supplying section for supplying the component to be mounted,
16
′ a parts tray that serves as an example of the component supplying section
16
in which components are arranged in a matrix form,
16
a
a parts cassette that serves as an example of the component supplying section
16
in which tape components are stored,
16
b
a bulk cassette that serves as an example of the component supplying section
16
in which components are stored, and
16
c
a parts tray storing section for storing the parts tray
16
′. As shown in
FIG. 18
, there is known the mounting apparatus having the above construction, which operates to pick up an electronic component from the component supplying section
16
by the mounting head
13
and move the electronic component held by the mounting head
13
to the mounting table
14
while recognizing the posture and so on of the electronic component held by the mounting head
13
, thereafter moving the electronic component by the mounting head
13
to the mounting position on the board
1
held on the mounting table
14
and subsequently lowering the mounting head
13
to execute the mounting of the electronic component in the mounting position of the board
18
. It is to be noted that the BGA components are generally stored in the parts tray
16
′ or the parts cassette
16
a
. The components can be mounted in and supplied from the tape-shaped parts cassette
16
a
, the bulk cassette
16
b
for components stored in a scattered form, the component supply section
16
′ that concurrently serves as a plate-shaped parts tray, and the like, which serve as a removable component set for continuously supplying the components. Further, the printed board
1
is conveyed onto the mounting table
14
for mounting the components, by the conveyance rails
15
, and subjected to a specified mounting process, and thereafter the printed board
1
is conveyed to the outside by the conveyance rails
15
.
Further,
FIG. 19
shows a sectional view showing the mounting of a BGA component by the component mounting apparatus shown in FIG.
18
. Solder paste
7
′ is provided on the connection lands
2
of the printed board
1
shown in
FIG. 16A
, and the BGA component
5
supplied from the component supplying section
16
is held by the mounting head
13
and moved to a specified position of the printed board
1
. Thereafter, as shown in
FIG. 19
, the BGA component
5
held by the mounting head
13
is depressed in the direction of the arrow D so as to connect the solder bumps
7
of the BG connecting portions
6
to the connection lands
2
of the printed board
1
via the solder paste
7
′ provided on the lands
2
.
The operation of the prior art electronic component mounting apparatus will be described with reference to FIG.
16
. This component mounting apparatus
10
is to mount an electronic component (BGA component
5
) on the printed board
1
. On the component supplying section
16
or
16
′ is provided a cassette or a tray conforming to the type of the electronic component necessary for actual mounting by the component mounting apparatus
10
. Each cassette or tray supplies a component that is needed every moment.
The component necessary for the mounting is taken out by the mounting head
13
, and the electronic component is subjected to component recognition executed by the component inspecting section
13
a
and to quality check (good-or-bad decision) and retention posture check of the component by comparing the result of recognition with the shape preparatorily stored in the control section. On the basis of the result of this check, posture correction data of the component is stored in the control section in a correction process as needed, and then, the target mounting land position on the printed board
1
is recogni
Kuribayashi Takeshi
Nakano Kazuyuki
Cuneo Kamand
Matsushita Electric - Industrial Co., Ltd.
Wenderoth , Lind & Ponack, L.L.P.
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